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Processes


  • Deposition processes

    - Electron beam or resistive evaporation,
    - DC / RF magnetron,
    - PACVD,
    - CVD.

  • Etching processes

    - Planar plasma etching,
    - Reactive ionic etching,
    - Oxygen plasma etching.

  • Plasma processes

    - Ion cleaning,
    - Flushing,
    - Degreasing.
Plasma

Circular magnetron


Equipment


  • Substrates

    - Silicon wafer,
    - Flat substrates,
    - 3D substrates, any shapes,
    - Wire,
    - Metal or plastic films.

  • Work chamber

    - Stainless steel, Aluminum,
    - Cylinder, rectangular shaped, or personalized,
    - Heated or cooled.

  • Substrates loading

    - Manual mode,
    - Load lock,
    - Storage box,
    - Loading robots.

  • Pumping system

    - Backing pumps,
    - Turbomolecular, diffusion, cryogenic, roots pumps,
    - Pressure control system.

  
  • Gas supply

- Neutral or corrosive gas,
- Mass flow controllers.

  • Power supplies

    - DC, pulsed DC, RF, HF generators,
    - Automatic matching network.

  • Measurement and characterization

    - Pirani, Penning, Bayard-Alpert gauges,
    - Baratron capacitance manometers,
    - Optical spectrometry, ellipsometry.

  • Automation

    - Wired logic,
    - Programmable controller,
    - Active synoptic,
    - PC animated supervision and synoptic,
    - Manual, semi-automatic or automatic mode,
    - Password restricted access,
    - Automatic calibration.


Applications


Evaporator
 

Last modification : 27/05/05